Miniaturization of PCBAs presents the challenge of ensuring that despite their decreasing size, contacts and components continue to work reliably. It is essential that components on the PCBs such as chips and sensors work properly in the most diverse fields of application under extreme conditions. In this regard, Epoxies play a critical role. Many PCBAs in advance electronics devices typically will need epoxies for Die Attach, Encapsulation of chips, underfill, Edge bonding CIPG or FIPG etc. Delo Adhesives together with IR Corporation Pte Ltd can provide cutting edge products, expertise and solutions to you for all your epoxies and adhesives applications.

Would you be interest to evaluate some of our material for your products and processes. We can make arrangement to send you some samples. We’re ready to show you how our epoxy and adhesives can make a difference in your operations.